ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,891, issued on Nov. 3, was assigned to CANON K.K. (Tokyo). "Photoelectric conversion apparatus and photoelectric conversion system" was inve... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,892, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Display apparatus" was invented by Dooho Jeong... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,893, issued on Nov. 3, was assigned to Truly (Huizhou) Smart Display Ltd. (Huizhou City, China). "Display panel and display device" was inve... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,894, issued on Nov. 3, was assigned to MEDIATEK SINGAPORE PTE. LTD. (Singapore). "Semiconductor package structure" was invented by Jubao Zha... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,895, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo). "Method for manufacturing semiconductor device, semiconductor devi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,896, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Power semiconductor module arrangement" was invented ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,897, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Terminal structure and wiring substrate" was in... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,898, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Device comprising wall pillar interconnects" was invented by Yujen Chen (... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,899, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyungdo... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,342, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Embedding vectors for three-dimensional modeling" was invented by Florian... Read More